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​Industrial Manufacturing Process And Details of Chip Capacitors

Views: 0     Author: Site Editor     Publish Time: 2024-08-12      Origin: Site

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​Industrial Manufacturing Process And Details of Chip Capacitors

Industrial manufacturing process and details of chip capacitors

This paper describes in detail the complete production process of chip capacitor from raw material preparation to finished product testing. By analyzing key technologies and quality control measures at different manufacturing stages, it provides a comprehensive and in-depth understanding for readers inside and outside the industry.

Introduction to chip capacitors

Market demand and technology development trend

The importance of the manufacturing process

2. Prepare raw materials

Ceramic powder preparation: including the selection, mixing, ball milling and other processes of high purity metal oxides to ensure uniform particles and good electrical properties.

Slurry preparation: the ceramic powder and organic adhesive are mixed in proportion to form a slurry with certain fluidity and stability.

Film production: Using the casting method or spraying method to make thin sheets of slurry, and dry treatment.

3. Production process

Stacking and pressing: the multi-layer membrane is superimposed and pressed according to the design requirements to form an unsintered embryo.

Cutting and arrangement: According to the required size specifications, the raw embryo is cut using precision cutting equipment and placed in a special arrangement in a special mold.

Sintering: Sintering is carried out under high temperature conditions to volatilize organic components, densify ceramic materials, and form a stable capacitor structure.

Electrode production: Silver paste or copper paste is printed on the surface of the capacitor as an electrode, and is fixed by sintering.

4. Testing and screening

Preliminary test: carry out appearance inspection, size measurement and other basic tests for each batch of products.

Electrical parameter testing: Use high-precision instruments to measure key electrical parameters such as capacitance, loss Angle tangent value (tanδ) and voltage resistance.

Reliability test: including temperature cycle test, humidity test, life test, etc., to ensure that the product can work properly in harsh environments.

5. Packaging and logistics

Finished product packaging: According to customer needs to choose the appropriate packaging form, such as anti-static bags, pallets, etc.

Label identification: Print labels that contain information such as product model and batch number for easy traceability management.

Logistics distribution: Through professional logistics services to safely deliver products to customers.

6. Quality control and improvement

Quality management system: Establish ISO9001 and other international standards of quality management system to ensure that the production process meets high standards.

Continuous improvement: Through statistical analysis of production data, continuous optimization of process flow, improve product quality and production efficiency.

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The company focuses on the packaging and testing of IC chips, semiconductor diodes, triodes, MOSFET tubes, thyristors, three-terminal regulators, bridge stacks and other products.

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